NISSEI Industry Corporation

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New Product



Vertical Double Disc Surface Grinding Machine for Small and Thin Components

Space-saving and low-cost Vertical Double Disc Grinder specialized for small and thin components


Main Specifications

Machine Dimensions1,100 (D) x 600 (W) x 1,475 (H) mm φ150mm CBN/diamond wheels
Machine WeightApprox. 1,000kg
GW Drive MotorAC servomotor 1.0kW x 2
Grinding MethodRotary carrier / carrier oscillation
Typical WorkpieceSmall and thin components with OD less thanφ10mm and minimum thickness 0.4mm
- This is NISSEI’s new product focused on saving spaces and costs. It is integrated with a coolant device and enables to start grinding operation immediately on the day of machine delivery.

- AC servomotors are installed for main spindle drive for accurate rotation speed setting.

- It is possible to select two types of grinding methods: rotary carrier and carrier oscillation.

- Automatic dressing device is installed as a standard accessory. Automatic sharpening dress with WA stone can be automatically executed.
- Mitsubishi Electric PLC is adopted for the machine control.
The machine is operated with push buttons located at machine front. Parameter settings and setup operations are performed with a handy HMI.
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